Design and Modeling of a Terahertz Transceiver for Intra- and Inter-chip Communications in Wireless Network-on-Chip Architectures

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aut.relation.issue10
aut.relation.journalSensors (Basel)
aut.relation.startpage3220
aut.relation.volume24
dc.contributor.authorPaudel, Biswash
dc.contributor.authorLi, Xue Jun
dc.contributor.authorSeet, Boon-Chong
dc.date.accessioned2024-05-28T04:07:54Z
dc.date.available2024-05-28T04:07:54Z
dc.date.issued2024-05-18
dc.description.abstractThis paper addresses the increasing demand for computing power and the challenges associated with adding more core units to a computer processor. It explores the utilization of System-on-Chip (SoC) technology, which integrates Terahertz (THz) wave communication capabilities for intra- and inter-chip communication, using the concept of Wireless Network-on-Chips (WNoCs). Various types of network topologies are discussed, along with the disadvantages of wired networks. We explore the idea of applying wireless connections among cores and across the chip. Additionally, we describe the WNoC architecture, the flip-chip package, and the THz antenna. Electromagnetic fields are analyzed using a full-wave simulation software, Ansys High Frequency Structure Simulator (HFSS). The simulation is conducted with dipole and zigzag antennas communicating within the chip at resonant frequencies of 446 GHz and 462.5 GHz, with transmission coefficients of around -28 dB and -33 to -41 dB, respectively. Transmission coefficient characterization, path loss analysis, a study of electric field distribution, and a basic link budget for transmission are provided. Furthermore, the feasibility of calculated transmission power is validated in cases of high insertion loss, ensuring that the achieved energy expenditure is less than 1 pJ/bit. Finally, employing a similar setup, we study intra-chip communication using the same antennas. Simulation results indicate that the zigzag antenna exhibits a higher electric field magnitude compared with the dipole antenna across the simulated chip structure. We conclude that transmission occurs through reflection from the ground plane of a printed circuit board (PCB), as evidenced by the electric field distribution.
dc.identifier.citationSensors (Basel), ISSN: 1424-8220 (Print); 1424-8220 (Online), MDPI AG, 24(10), 3220-. doi: 10.3390/s24103220
dc.identifier.doi10.3390/s24103220
dc.identifier.issn1424-8220
dc.identifier.issn1424-8220
dc.identifier.urihttp://hdl.handle.net/10292/17605
dc.languageeng
dc.publisherMDPI AG
dc.relation.urihttps://www.mdpi.com/1424-8220/24/10/3220
dc.rights© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
dc.rights.accessrightsOpenAccess
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subjectintra- and inter-chip communication
dc.subjecton-chip antenna
dc.subjectsystem-on-chip
dc.subjectterahertz technology
dc.subjectwireless network on chips
dc.subjectintra- and inter-chip communication
dc.subjecton-chip antenna
dc.subjectsystem-on-chip
dc.subjectterahertz technology
dc.subjectwireless network on chips
dc.subject40 Engineering
dc.subject46 Information and Computing Sciences
dc.subject4006 Communications Engineering
dc.subject4008 Electrical Engineering
dc.subject4009 Electronics, Sensors and Digital Hardware
dc.subject7 Affordable and Clean Energy
dc.subject0301 Analytical Chemistry
dc.subject0502 Environmental Science and Management
dc.subject0602 Ecology
dc.subject0805 Distributed Computing
dc.subject0906 Electrical and Electronic Engineering
dc.subjectAnalytical Chemistry
dc.subject3103 Ecology
dc.subject4008 Electrical engineering
dc.subject4009 Electronics, sensors and digital hardware
dc.subject4104 Environmental management
dc.subject4606 Distributed computing and systems software
dc.titleDesign and Modeling of a Terahertz Transceiver for Intra- and Inter-chip Communications in Wireless Network-on-Chip Architectures
dc.typeJournal Article
pubs.elements-id553456
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