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Next-Generation Wireless On-Chip Communication Using Terahertz Antennas

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Thesis(19.87 MB)

Date

2025

Authors

Paudel, Biswash

Supervisor

Li , Xuejun
Seet, Boon-Chong

Item type

Thesis

Degree name

Doctor of Philosophy

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Publisher

Auckland University of Technology

Abstract

The exponential growth of data-driven technologies, including artificial intelligence (AI), high-definition sensing, and wireless chip-to-chip interconnects, has intensified the demand for ultra-high-speed, energy-efficient communication systems. Conventional microwave and millimetre-wave solutions are reaching their physical and spectral limits, prompting a shift toward the terahertz (THz) band (0.1–10 THz) for next-generation wireless networks. The THz spectrum offers unprecedented bandwidth and spatial resolution but remains hindered by propagation loss, fabrication tolerances, and integration constraints within semiconductor environments. These challenges define a crucial research gap in realizing compact, low-loss, and CMOS-compatible THz antenna systems. This thesis addresses that gap through the design and modelling of advanced on-chip and substrate-integrated THz architectures. First, a stacked substrate-integrated waveguide (SIW) pyramidal horn antenna is proposed to achieve beam symmetry, high gain, and planar compatibility. The design employs multilayer dielectric loading and Gaussian excitation to balance E- and H-plane radiation, demonstrating efficient operation around 210 GHz. Second, a broadband, probe-less rectangular-waveguide (RWG) to SIW mode converter is introduced, enabling low-reflection TE10 to TE20 transitions and compact interfacing between metallic and planar structures. Finally, the thesis models intra- and inter-chip THz communication channels using realistic on-chip antennas and packaging materials, evaluating coupling efficiency, loss mechanisms, and spatial field behaviour for Wireless Network-on-Chip (WiNoC) applications. Collectively, these works contribute new insights into THz front-end integration, demonstrating that multilayer SIW antennas and mode converters can deliver high performance and scalability within chip-scale systems. The research establishes a foundation for CMOS/BiCMOS-compatible THz transceivers, paving the way for future 6G and Integrated Sensing and Communication (ISAC) platforms. Future work should focus on fabrication, experimental validation, and reconfigurable metamaterial loading to further enhance bandwidth, tunability, and practical deployment of on-chip THz systems.

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http://hdl.handle.net/10292/20952

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