Diegel, OSingamneni, SHuang, BGibson, I2011-08-182011-08-18201120112nd International Conference on Manufacturing Science and Engineering (ICMSE 2011), Guilin, Chinahttps://hdl.handle.net/10292/1756This paper describes a curved-layer additive manufacturing technology that has the potential to print plastic components with integral conductive polymer electronic circuits. Researchers at AUT University in New Zealand and the National University of Singapore have developed a novel Fused Deposition Modeling (FDM) process in which the layers of material that make up the part are deposited as curved layers instead of the conventional flat layers. This technology opens up possibilities of building curved plastic parts that have conductive electronic tracks and components printed as an integral part of the plastic component, thereby eliminating printed circuit boards and wiring. It is not possible to do this with existing flat-layer additive manufacturing technologies as the continuity of a circuit could be interrupted between the layers. With curved-layer fused deposition modeling (CLFDM) this problem is removed as continuous filaments in 3 dimensions can be produced, allowing for continuous conductive circuits.Authors retain the right to place his/her pre-publication version of the work on a personal website or institutional repository on condition that there is a link to the definitive version on the Trans Tech Publications web site. www.scientific.netCurved Layer Fused Deposition ModelingConductive 3D printingAdditive ManufacturingConference ContributionOpenAccess